New TGV (Through-Glass Via) etch series for advanced packaging

As demand for 2.5D/3D packaging and glass interposers grows, TGV (through-glass via) processes demand tighter morphology control and selectivity. Building on existing etch systems, SEMPURION introduces a high-selectivity TGV series.

The new products maintain via verticality and smooth sidewall while markedly improving selectivity to photoresist/metal masks, reducing undercut and defects for higher via yield and batch stability in mass production.

Paired with companion cleaning and developing products, the series completes the TGV chemical chain. SEMPURION will keep filling the full etch-clean-develop-strip sequence for advanced packaging.