News
Company & Product News
Latest updates from SEMPURION Chemistry
2026-09-14Company Notice›2026-09-08Product News›2026-09-05Company News›2026-09-03Company News›2026-09-01Product News›2026-08-28R&D Breakthrough›2026-08-20Technology›2026-08-12Product›2026-08-05Product›2026-07-29Technology›2026-07-22R&D News›
2026 Mid-Autumn Festival & National Day Holiday Notice
Per the State Council's 2026 holiday schedule, SEMPURION will be closed Sep 25-27 for Mid-Autumn Festival (3 days) and Oct 1-7 for National Day (7 days). Last dispatch before the holiday is Sep 23; shipping resumes Oct 9. Please plan your orders and stock accordingly.
SEMPURION Launches Carbon-Based Composite Hot-Bend Mold for 750°C+ Microcrystalline Glass Forming
New CC-3D carbon-based composite hot-bend mold withstands 750°C+ microcrystalline glass forming, delivering up to 50x the service life of graphite molds.
SEMPURION Chemistry Launches New Bilingual Website with Full Product Center
The new bilingual site publishes 85 products across 7 business lines with full specifications and process-based search.
85 Products Reorganized into 7 Business Lines with Upgraded Data System
SEMPURION completed a systematic review of all products, unifying naming and taxonomy into a fully structured database.
Semiconductor & Packaging Chemical Line Expands Across Clean, Etch and Develop
New etchants, developers and process cleaners further complete advanced packaging process support.
In-house AI mechanistic R&D platform adds computational acceleration to high-purity process formulations
Combining machine learning, generative models and computational-chemistry simulation into a digital laboratory for high-purity process chemicals, validated in wet experiments.
Metal-ion control breakthrough in high-purity process chemicals, with key grades reaching ppb level
Through purification-process and online-monitoring optimization, metal-ion impurities in key etch/clean grades are further reduced, improving batch consistency and cleanliness.
New TGV (Through-Glass Via) etch series for advanced packaging
A high-selectivity etch system for glass vias and interposers balances fine morphology and via yield, completing the advanced packaging chemical portfolio.
Display-module process cleaning formulation upgraded for better residue removal and cleanliness
Upgraded aqueous and semi-aqueous formulas for lamination, stripping and inter-process cleaning improve residue removal and surface cleanliness with material compatibility.
Low-VOC aqueous cleaning series supports green, low-carbon manufacturing
Cutting solvent use and VOC emissions while preserving cleaning power offers a greener, safer alternative and passes relevant environmental/safety compliance.
Co-building joint process labs to deepen formulation-equipment-process synergy
Joint labs with customers and equipment partners co-develop formulations and processes around specific pain points, shortening time from selection to mass production.