Specialty New Materials
(3)Carbon-based composite mold for 3D glass hot forming that withstands 750°C+ (enabling glass-ceramic forming) and delivers over 50x the service life of graphite molds, supporting 3D double-curved and large-curvature shapes.
Carbon-based composite diffusion-bonding mold that replaces graphite tooling for solid-state Cu-Al diffusion bonding and Cu-Al vacuum brazing of soft busbars (laminated busbars, flexible connectors, nickel/aluminum transition strips) — heat- and pressure-tolerant, dimensionally stable and non-shedding
Carbon-based composite high-temperature carrying fixtures/trays replacing graphite and metal tooling for sintering, heat treatment and other high-temperature processes.
Semiconductor & Packaging
(25)Dedicated pre-cleaner for particle removal on FOUP/FOSB: concentrate diluted 1:4, neutral pH 6.5–7.5, chemical clean at 50–65 °C for 3–8 min, spray-safe with <5 mm foam
Flagship of the SP-Clear series: primary product for organic contamination and VOC removal on FOUP/FOSB — 1:4 dilution, pH 8.5–9.5, clean at 55–75 °C for 5–10 min; HSP verified RED=0.59
Dedicated cleaner for high-temperature PEI ESD FOUP: 1:4 dilution, pH 9.5–10.5, clean at 70–90 °C for 5–10 min (not for PC ESD material)
Strong-alkali cleaning for PFA/PTFE/Teflon wafer carriers and cleaning baskets: 1:9 dilution, pH 12.8–13.2, clean at 70–100 °C for 5–15 min — spray, immersion or ultrasonic
Neutral cleaner for mask and reticle storage boxes: 1:4 dilution (UPW recommended), pH 6.5–7.5, clean at 40–60 °C for 5–10 min; GLDA+EDTA dual chelation for Haze control
One-step removal of blue/UV tape adhesive residue after wafer dicing, balancing stripping power with wafer/chip safety.
Removes particles and metallic residues after CMP; technology extension of the SP-Clear series.
Efficient removal of polymer residues after dry etch and ashing; water-based with high closed-cup flash point for safe operation at 70°C.
Removes edge bead residue after lithography; electronic-grade purity for yield protection.
Low-foam mild-alkaline cleaner removing residual plating solution and particles after bump plating.
Removes adhesive residue left after temporary bonding/de-bonding; water-based with a closed-cup flash point above 60°C for safe heated operation.
Removes particles and metallic residues after back-grinding/thinning; improved SC1-type formulation.
Cleans inside high-aspect-ratio through-glass vias; surface tension below 30 mN/m lets the bath penetrate straight to the via bottom.
Post-etch surface and post-CMP cleaning compatible with fluorine-containing etch residues on TGV glass substrates.
Selective etching of Cu/Ti seed layers for TGV/RDL patterning with endpoint control and near-zero attack on the glass substrate.
Complete UBM seed-layer etch kit — separate copper and titanium etchants for stepwise processing; near-zero glass loss.
Modifies glass before TGV seed-layer deposition to multiply copper adhesion; 5B tape-peel rating and 240 h 85°C/85%RH reliability demonstrated.
High-purity Ti etching for 1 µm fine lines with side etch below 0.3 µm; excellent selectivity to glass, SiO₂ and photoresist.
Etchant for next-generation Mo interconnect metal, positioning for future process nodes; classic PAN chemistry plus an Al-compatible option.
Etchant for ruthenium, a candidate next-generation interconnect metal; formulation significantly suppresses escape of highly toxic volatile byproducts.
W/TiW etching for advanced packaging metallization; cyanide-free alkaline chemistry with stable supply chain.
Packaging-grade standard developer system for RDL processes; electronic-grade purity with no metal ions (MIF).
Through-glass-via etch by femtosecond-laser modification plus hot-alkali etching; >50:1 selectivity with near-zero etch of bulk glass and no toxic fluorine acids.
Cleaning, lubrication, anti-corrosion and cooling in one — built for high-precision dicing of hard-brittle materials; less edge chipping, protects on-metal layout and pads, easy to rinse clean.
Cleaning, lubrication, anti-corrosion and cooling in one; a unique formula supporting high-dilution use (1:2000) for high efficiency at low cost — same functions as SEM-1000.
Display Module
(13)Strips RDL/semiconductor photoresist by migrating proven ACF-debonding chemistry; copper loss below 0.05 µm/h at 70°C.
Cold-soak removal of ACF adhesive residue without attacking ITO; works at room temperature with no heating equipment.
Precision cleaning before IC/display bonding; halogen-free, phosphorus-free, nitrogen-free and flash-point-free, designed to a no-residue standard.
Removes OCA/LOCA adhesive residue during screen disassembly and rework without damaging the polarizer.
Chemical stripping of polarizers during display-module disassembly/recycling; alkali bath separates polarizer from glass while protecting the glass substrate.
Rework debonding of UV-cured adhesives for optical and circuit-board parts; compliant alternative free of carcinogenic halogenated solvents.
Color-filter development benchmarked against Nippon Kayaku; fills a near-empty domestic gap for color-filter lines.
Process cleaning for color-filter lines; safe to ITO, phosphorus-free and APEO-free with a low-foam design.
Substrate cleaning before polyimide coating; respects the PI red line — no hydrolysis or swelling damage to cured alignment layers.
Cleaning for the liquid-crystal stage of panel processes; a three-no standard keeps the LC cell safe.
Pattern etching of ITO for panels and touch; organic-acid route with excellent selectivity to glass, photoresist and black matrix.
Etches Mo/Al wiring in copper-process TFT-LCD lines for 4K2K panels; blended-acid mainstream route balancing etch rate and line profile.
Safety companion for glass thinning lines — pre-thinning pretreatment and post-thinning cleaning on a fluorine-free route.
Optical Glass & Sapphire
(42)Process cleaning for 3D curved glass.
General-purpose cleaning across glass manufacturing processes.
Eco-friendly glass cleaning.
Eco-friendly glass cleaning with fast drying and fewer water marks.
General-purpose alkaline cleaning for glass substrates.
Oxidative-decomposition cleaning for glass.
Multi-component general-purpose cleaning for glass process lines.
Pre-bending degreasing plus coolant-residue cleaning in one product.
Drop-in domestic alternative to Deconex OP164 for precision glass cleaning.
Neutral cleaning for panel AOI inspection steps.
Companion additive for the OP164 cleaning system.
Dedicated stripper for TOYO-series inks combining strong alkali with penetrating peel-off chemistry.
Mature alkaline ink-stripping solution that adapts directly to production-line processes.
General-purpose screen-printing ink stripper.
One bath strips both ink and coatings on optical glass — a dual-function solution covering two rework cases.
Customer-process-tuned, high-solvent stripper targeting stubborn screen-printing inks.
Combined adhesive-debonding and ink-stripping solution — one product for two rework jobs.
Dedicated rework stripper for cover glass; stable alkali-plus-penetrating-solvent ink removal.
Mass-production stripper for TOYO BL-7M056 ink; strong-alkali plus penetrating peel-off system; 1,581 units passed full production validation.
Stripper for PVD coatings on glass.
Stripper for coated glass parts using a blended acid-etch system.
Project-customized stripper for niobium pentoxide (Nb₂O₅) coatings on optical coated glass.
Ambient-temperature stripping · eco-friendly acidic system · HF-free, no potassium ferricyanide · 2–5 min stripping
Removes nickel coatings from glass without damaging the glass or the ink — mild acid-etch system.
Specialized adhesive debonding for fingerprint modules using an alkaline plus penetrating-solvent swelling system.
High-concentration display lamination adhesive remover (final version) that strips adhesive without damaging the AF coating.
Lamination-adhesive remover that protects the AF coating throughout the debonding process.
Simplified lamination-adhesive remover that keeps the core AF-safe capability with a leaner system.
Adhesive remover for display lamination debonding.
Low-foam cleaner built for spray cleaning lines.
Low-foaming cleaner for washing/spray lines.
Simplified low-foam cleaner.
Ceramic-based high-temperature release coating for glass hot bending; withstands 850°C+ in oxidizing atmospheres (900–1250°C upgrade under development).
Cleans hot-bending graphite molds without damaging the graphite.
Cooling and lubrication fluid dedicated to CNC grinding of glass.
Solvent-type machine wash for cleaning production equipment.
Specialized remover for display lamination adhesive.
Wipe-cleaning reagent for equipment surfaces with a blended-solvent system.
Aqueous anti-static functional cleaner: added directly to the customer's existing alkaline or neutral cleaning bath, it neutralises surface static charge and suppresses static re-generation during cleaning, preventing particle adsorption that forms pitting and white spots before and after coating, while improving water-film spreading for a fast-drying, streak-free finish.
Selective ambient-temperature stripping of the visible area on PC / PMMA decorative parts — substrate and decorative coating preserved.
Ambient-temperature stripping · eco-friendly acidic system · HF-free, no potassium ferricyanide · low-concentration grade
Post-coating cleaning · neutral system that does not attack the coating · low-foam spray · 45–50 °C / 1–3 min
Metal & Plastic
(8)Dedicated stripper for PVD coatings on metal parts.
Removes heavy plated coatings from umbrella hardware.
Dedicated degreaser for CNC-machined aluminum parts.
Post-fine-grinding cleaning for metal and glass parts.
Stainless steel degreasing completed in 1 minute at 10% concentration and 55°C.
Acidic co-cleaner system for fine-ground metal and glass.
Fluorine-containing acidic composite passivation for stainless steel and aluminum alloys.
Abrasive-additive anti-static agent: added directly to the blasting abrasive, 0.5–1.0% markedly reduces friction-generated static, suppressing dust adsorption and abrasive agglomeration without affecting the blast finish.
SMT Stencil
(4)Eco-friendly water-based cleaner that thoroughly removes flux and rosin residues.
Semi-aqueous stencil cleaner with solvency and eco-profile between solvent-based and water-based products.
Semi-aqueous, eco-friendly removal of post-soldering flux and rosin residues.
Low-residue, fast-drying cleaning after BGA rework.
Equipment Consumables
(4)High-purity molybdenum boat for vacuum evaporation and sintering carriers, T0.2×L58 mm.
Thin-profile molybdenum boat for fine coating jobs, T0.15×H15×W23 mm.
High-purity molybdenum evaporation carrier box for high-temperature loading.
Carbon tube for coating and process use — companion consumable supply.