TW-100
TW-100 Post-Thinning Wafer Cleaner (SC1-Type)
Removes particles and metallic residues after back-grinding/thinning; improved SC1-type formulation.
Technical Description
TW-100 is an improved SC1-type cleaner from Shengpu Chemical for removing grinding debris and metallic residues from thinned wafers after back-grinding. Benchmarked against electronic-grade SC1 chemistries from Kanto and Mitsubishi Chemical, it is mixed on site at A:B:DI water = 1:1:5 with a 4–8 h working bath life and applied by spray or megasonic at 40–60°C, supporting yield and cleanliness in semiconductor manufacturing and advanced packaging lines.
Introduction
TW-100 Post-Thinning Wafer Cleaner (SC1-Type) (TW-100) is developed by SEMPURION for Thinned wafers after grinding as a Carrier / Wafer product.Key advantage: Removes particles and metallic residues after back-grinding/thinning; improved SC1-type formulation.. Benchmarked against Industry SC1 standard (Kanto / Mitsubishi Chemical electronic-grade SC1). Key features: Mixed on site just before use; working bath life 4–8 h. Typical process: Customer mixes A:B:DI water = 1:1:5 on site; spray or megasonic 40–60°C for 5–10 min; DI water rinse 2–3 times then dry.
Quick Specs
Features
Mixed on site just before use; working bath life 4–8 h
Process & Usage
Customer mixes A:B:DI water = 1:1:5 on site; spray or megasonic 40–60°C for 5–10 min; DI water rinse 2–3 times then dry
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- Phone
- +86 769-82786068
- sales@sempurion.com
- Website
- www.sempurion.com
- Address
- Songshan Lake, Dongguan, Guangdong, China