SA-100
SA-100 Glass Surface Modification Agent
Modifies glass before TGV seed-layer deposition to multiply copper adhesion; 5B tape-peel rating and 240 h 85°C/85%RH reliability demonstrated.
Technical Description
SA-100 is a glass surface modification agent from Shengpu Chemical that strengthens copper adhesion before TGV seed-layer sputtering on glass substrates. Benchmarked against Zhipu, it is a surface-bonding coupling-agent system that hydrolyzes to chemically bond glass-surface hydroxyls and coordinates the Ti/Cu interface, forming a firm glass–coupling-layer–metal bond. After treatment the water contact angle drops below 20°, sputtered Cu films pass the 5B tape-peel test and survive 240 h at 85°C/85%RH without delamination, supporting the metallization yield of TGV glass in advanced packaging lines.
Introduction
SA-100 Glass Surface Modification Agent (SA-100) is developed by SEMPURION for TGV glass substrates (pre-seed-layer treatment) as a TGV / Process product.Key advantage: Modifies glass before TGV seed-layer deposition to multiply copper adhesion; 5B tape-peel rating and 240 h 85°C/85%RH reliability demonstrated.. Benchmarked against Zhipu. Key features: Surface-bonding silane-coupling-agent system — hydrolyzes to bond chemically with glass surface hydroxyls while the other end coordinates the Ti/Cu interface, forming a firm glass–coupling-layer–metal bond; gelation prevented; water contact angle <20° after treatment; Cu sputtered film passes 5B tape-peel test; no delamination after 240 h at 85°C/85%RH. Typical process: After pre-cleaning/activation of the glass, apply by spray, spin-coat or immersion (bubble-free inside vias); cure 5 min at room temperature or 10–30 min at 80–120°C; light DI rinse, N₂ blow-dry, then PVD sputtering (formulated on site by the customer).
Quick Specs
Features
Surface-bonding silane-coupling-agent system — hydrolyzes to bond chemically with glass surface hydroxyls while the other end coordinates the Ti/Cu interface, forming a firm glass–coupling-layer–metal bond; gelation prevented; water contact angle <20° after treatment; Cu sputtered film passes 5B tape-peel test; no delamination after 240 h at 85°C/85%RH
Process & Usage
After pre-cleaning/activation of the glass, apply by spray, spin-coat or immersion (bubble-free inside vias); cure 5 min at room temperature or 10–30 min at 80–120°C; light DI rinse, N₂ blow-dry, then PVD sputtering (formulated on site by the customer)
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- Phone
- +86 769-82786068
- sales@sempurion.com
- Website
- www.sempurion.com
- Address
- Songshan Lake, Dongguan, Guangdong, China