TGV-CS1 Mild-Alkaline Spray Cleaner for Through-Glass Vias
Semiconductor & PackagingTGV / Process

TGV-CS1

TGV-CS1 Mild-Alkaline Spray Cleaner for Through-Glass Vias

Post-etch surface and post-CMP cleaning compatible with fluorine-containing etch residues on TGV glass substrates.

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Technical Description

TGV-CS1 is a mild-alkaline spray cleaning chemistry from Shengpu Chemical for TGV glass substrates after etching and CMP steps. Benchmarked against the alkaline route of Parker PK-LCG255 class products, it removes etch and polish residues including fluorine-containing etch byproducts while brief mild-alkaline contact keeps the glass surface haze-free, supporting yield and cleanliness in semiconductor manufacturing and advanced packaging lines.

Introduction

TGV-CS1 Mild-Alkaline Spray Cleaner for Through-Glass Vias (TGV-CS1) is developed by SEMPURION for TGV glass substrates as a TGV / Process product.Key advantage: Post-etch surface and post-CMP cleaning compatible with fluorine-containing etch residues on TGV glass substrates.. Benchmarked against Parker PK-LCG255 class (alkaline route). Key features: Brief mild-alkaline contact does not fog (haze) the glass surface. Typical process: Spray (1–2 bar) at 45–55°C for 3–5 min; DI water rinse 2–3 times.

Quick Specs

Benchmark
Parker PK-LCG255 class (alkaline route)
Application
TGV glass substrates
Materials
TGV glass substrates

Features

Brief mild-alkaline contact does not fog (haze) the glass surface

Process & Usage

Spray (1–2 bar) at 45–55°C for 3–5 min; DI water rinse 2–3 times

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Address
Songshan Lake, Dongguan, Guangdong, China

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