PCMP-100
PCMP-100 Post-CMP Cleaning Solution
Removes particles and metallic residues after CMP; technology extension of the SP-Clear series.
Technical Description
PCMP-100 is a post-CMP cleaning solution from Shengpu Chemical that removes particles and metallic residues left after chemical-mechanical planarization. Benchmarked against comparable industry products and built as an extension of the SP-Clear series technology, it applies megasonic or spray cleaning at 40–55°C with 0.2 µm final filtration and targets metal residues below 10 ppb after rinsing, serving yield and cleanliness in semiconductor manufacturing and advanced packaging lines.
Introduction
PCMP-100 Post-CMP Cleaning Solution (PCMP-100) is developed by SEMPURION for Post-CMP wafers as a Carrier / Wafer product.Key advantage: Removes particles and metallic residues after CMP; technology extension of the SP-Clear series.. Benchmarked against Industry-standard post-CMP cleaning, offered as a domestic alternative. Key features: 0.2 µm final filtration; metal residue target <10 ppb after rinsing. Typical process: Megasonic/spray cleaning 40–55°C for 5–10 min; DI water quick-dump/overflow rinse 2–3 times plus hot DI rinse (60°C, 2 min).
Quick Specs
Features
0.2 µm final filtration; metal residue target <10 ppb after rinsing
Process & Usage
Megasonic/spray cleaning 40–55°C for 5–10 min; DI water quick-dump/overflow rinse 2–3 times plus hot DI rinse (60°C, 2 min)
Need samples or datasheets?
Contact us for detailed specs, MSDS and sample support for PCMP-100
Related Guides
Need technical support or a sample?
Tell us your substrate, contamination and process conditions — our process engineers will recommend a grade and arrange sample validation.
- Phone
- +86 769-82786068
- sales@sempurion.com
- Website
- www.sempurion.com
- Address
- Songshan Lake, Dongguan, Guangdong, China