ET-Mo
ET-Mo Molybdenum Etchant
Etchant for next-generation Mo interconnect metal, positioning for future process nodes; classic PAN chemistry plus an Al-compatible option.
Technical Description
ET-Mo is a molybdenum etchant from Shengpu Chemical for advanced packaging and wafer Mo metallization, targeting next-generation interconnect metal adoption. Benchmarked against Kanto Chemical, the main system follows the classic PAN route — oxidation followed by acid dissolution into soluble molybdenum salts with controlled side etch — while a mild oxidizing variant compatible with aluminum handles Mo/Al/Mo three-layer stacks that the main system would attack. Immersion recipes with clear stop criteria and thorough rinsing give controlled, repeatable Mo patterning for advanced packaging lines.
Introduction
ET-Mo Molybdenum Etchant (ET-Mo) is developed by SEMPURION for Advanced packaging / wafer Mo metallization as a Etching / Developing product.Key advantage: Etchant for next-generation Mo interconnect metal, positioning for future process nodes; classic PAN chemistry plus an Al-compatible option.. Benchmarked against Kanto Chemical. Key features: Classic PAN molybdenum etch route — oxidizer converts Mo to soluble molybdate salts via acid dissolution with controlled side etch; an additional mild oxidizing system compatible with aluminum covers Mo/Al/Mo three-layer stacks (the main system attacks Al, so stacked structures must use the compatible type). Typical process: Main system: immersion 30–40°C with agitation 1–2 min (0.5 µm Mo), stop when cleared, DI overflow rinse ×3, then 50°C hot-water quick rinse to remove acid residue. Mild alternative: immersion 30°C for 3–10 min with agitation.
Quick Specs
Features
Classic PAN molybdenum etch route — oxidizer converts Mo to soluble molybdate salts via acid dissolution with controlled side etch; an additional mild oxidizing system compatible with aluminum covers Mo/Al/Mo three-layer stacks (the main system attacks Al, so stacked structures must use the compatible type)
Process & Usage
Main system: immersion 30–40°C with agitation 1–2 min (0.5 µm Mo), stop when cleared, DI overflow rinse ×3, then 50°C hot-water quick rinse to remove acid residue. Mild alternative: immersion 30°C for 3–10 min with agitation
Need samples or datasheets?
Contact us for detailed specs, MSDS and sample support for ET-Mo
Related Guides
Need technical support or a sample?
Tell us your substrate, contamination and process conditions — our process engineers will recommend a grade and arrange sample validation.
- Phone
- +86 769-82786068
- sales@sempurion.com
- Website
- www.sempurion.com
- Address
- Songshan Lake, Dongguan, Guangdong, China