Cleaning comparison
Post-dice wafer surface（photos）
- Control (no fluid)：Visible dust and indistinct streets; residue may affect downstream bonding.
- With SEM-1000：Crisp clean streets, dust-free, particle-free under microscope.
Semiconductor & PackagingCarrier / Wafer
SEM-1000
SEM-1000 Semiconductor Wafer Dicing Fluid
Cleaning, lubrication, anti-corrosion and cooling in one — built for high-precision dicing of hard-brittle materials; less edge chipping, protects on-metal layout and pads, easy to rinse clean.
Technical Description
SEM-1000 is Shengpu Chemical's next-generation dicing fluid for high-precision wafer and advanced-packaging singulation. It couples cleaning, lubrication, anti-corrosion and cooling: efficient surfactants rapidly wet and disperse micron-scale silicon/brittle debris to avoid re-deposition scratches, while excellent spreading forms a continuous lubricating film at the blade–wafer interface that lowers friction and cuts edge chipping, micro-cracks and blade marks for better yield and cosmetics. A dedicated compound inhibitor passivates metal traces and pads electrochemically, balancing cleanliness with corrosion protection. Dilute with DI water at ~1:300 (adjust 1:100–1:500) and monitor conductivity (<150 µS/cm) for stable high-cleanliness operation; suitable for spray or immersion, with near-neutral, low-ionic residue for a clean post-dice surface. SEM-1000 has been validated across multiple semiconductor and advanced-packaging dicing lines and can be customized per line for concentration, packaging and stable domestic supply.
00
Why dicing needs a dedicated fluid
Dicing is a critical packaging step. As dies shrink and wafers get thinner, high-speed blade cutting raises three process challenges.
01
Particle contamination
Micron silicon powder clings to the wafer; residue risks fails and lowers reliability.
02
Thermal damage & stress
High-speed blade heat and stress can cause micro-cracks and delamination.
03
Metal corrosion risk
Metal traces tend to electrochemically corrode in process water, breaking circuits and cutting yield.
The dicing fluid plays the core role: efficient cooling, lubrication, cleaning and anti-corrosion in one — a quality guarantee for precision dicing.
A
New-generation high-efficiency dicing solution
SEM-1000 is purpose-built for high-precision wafer dicing — advanced surfactants and functional additives deliver cleaning + lubrication + anti-corrosion in one, a performance promise for precision manufacturing.
Higher yield
Superior cleaning and lubrication cut micro-crack and residue risk
Quality assurance
Long-lasting corrosion protection, consistent quality in harsh conditions
Cost optimisation
Scientifically optimised, efficient use, lower total cost
Easy to use
Simple dilution, fast line integration, great compatibility
B
Four core technical advantages
01
Cleaning & dispersing
Efficient surfactants lower surface tension, penetrate the cut area fast and wrap silicon powder to stop re-deposition.
02
Wetting & lubrication
A protective film forms fast at the blade/wafer interface, cutting friction, edge damage and micro-cracks.
03
Anti-corrosion
Built-in complex inhibitor adsorbs on metal first, blocking moisture/oxygen to break the electrochemical corrosion path.
04
Low conductivity, high safety
Diluted working fluid stays under 150 µS/cm, minimising corrosion risk and adding safety for precise chips.
C
Validated in real production lines
SEM-1000 has been validated in continuous mass production across multiple semiconductor and advanced-packaging dicing lines — the leap from lab to demanding industrial volume.
Long-term stability
Consistent under high-volume continuous runs; no product-caused quality drift or unscheduled stops across the validation window.
Customer recognition
Passed rigorous vendor admission and full inspection; strong continuous-process results and core-supplier status for dicing fluid.
Mass-production proof
Proven not only against lab specs but across the complexity of real industrial mass production.
01
Technical Specifications
| Appearance | Clear to slightly cloudy liquid (25 °C) |
| Density | ≈1.0 g/cm³ (25 °C) |
| Conductivity (1:200 DI, 25 °C) | < 150 µS/cm |
| Recommended dilution | 1:300（纯水/去离子水） |
| Core function | Wetting, corrosion protection & silicon-powder dispersion to improve dicing yield |
| Standard packaging | 1 gal (≈3.78 L) drum / 1000 kg IBC; custom available |
| Shelf life | 90 days (sealed, cool dry storage) |
02
Performance & Verification
Corrosion & compatibility
Immersion before / after 8 h（micro）
- Condition：Chip in 1:500 dilution, 8 h — worst-case long contact.
- Result：Traces, pads and substrate intact — no pitting, oxidation or damage; consistent under microscope.
03
Application, Packaging & Service
How to use
Dilute：Dilute with DI water (recommend 1:300) and mix well to avoid local concentration differences.
Mix：Use mechanical or magnetic stirring to homogenise.
Spray & maintain：Apply via dicing spray system; check concentration/purity daily and replenish on schedule.
Packaging
Standard：Sealed 1 gal (≈3.78 L) drum — R&D & small batch
Industrial：1000 kg IBC tote — volume production, lower logistics cost
Custom：5 gal / 200 L and more on request
Technical consultation · free sample testing · after-sales support
Introduction
SEM-1000 Semiconductor Wafer Dicing Fluid (SEM-1000) is developed by SEMPURION for High-precision dicing/singulation of semiconductor wafers and advanced packaging (incl. hard-brittle substrates); post-dicing rinse as a Carrier / Wafer product.Key advantage: Cleaning, lubrication, anti-corrosion and cooling in one — built for high-precision dicing of hard-brittle materials; less edge chipping, protects on-metal layout and pads, easy to rinse clean.. Benchmarked against Domestic and international semiconductor dicing fluids; a high-cleanliness, low-ionic system for DI-water dilution. Key features: Surfactants lower surface tension to wet and suspend micron-scale chip debris, preventing re-deposition scratches; films at the blade–wafer interface cut friction and edge chipping/micro-cracks; debris rinses cleanly with DI water, leaving a bright surface; a compound corrosion inhibitor electively passivates metal traces and pads during soaking; near-neutral, low-ionic dilution suits high-cleanliness dicing. Typical process: Dilute with deionized water, recommended from 1:300 (tune 1:100–1:500 by line); monitor dilution conductivity (<150 µS/cm); spray/immersion on dicing tools at room temperature; store sealed, cool and light-free.
Quick Specs
Benchmark
Domestic and international semiconductor dicing fluids; a high-cleanliness, low-ionic system for DI-water dilution
Application
High-precision dicing/singulation of semiconductor wafers and advanced packaging (incl. hard-brittle substrates); post-dicing rinse
Materials
Wafers/chips (Si & compound semiconductors); metal traces and bond pads
Features
Surfactants lower surface tension to wet and suspend micron-scale chip debris, preventing re-deposition scratches; films at the blade–wafer interface cut friction and edge chipping/micro-cracks; debris rinses cleanly with DI water, leaving a bright surface; a compound corrosion inhibitor electively passivates metal traces and pads during soaking; near-neutral, low-ionic dilution suits high-cleanliness dicing
Process & Usage
Dilute with deionized water, recommended from 1:300 (tune 1:100–1:500 by line); monitor dilution conductivity (<150 µS/cm); spray/immersion on dicing tools at room temperature; store sealed, cool and light-free
Need samples or datasheets?
Contact us for detailed specs, MSDS and sample support for SEM-1000