DER-100 Dry-Etch & Ash Polymer Residue Remover
Semiconductor & PackagingCarrier / Wafer

DER-100

DER-100 Dry-Etch & Ash Polymer Residue Remover

Efficient removal of polymer residues after dry etch and ashing; water-based with high closed-cup flash point for safe operation at 70°C.

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Technical Description

DER-100 is a water-based residue remover from Shengpu Chemical that strips post-etch polymer residues left by dry etch and ashing on wafers and substrates. Benchmarked against comparable industry products, its water-based system offers a high closed-cup flash point for safe operation up to 70°C, applied ready-to-use by immersion, spray or ultrasonic before DI rinsing, supporting yield and cleanliness in semiconductor manufacturing and advanced packaging lines.

Introduction

DER-100 Dry-Etch & Ash Polymer Residue Remover (DER-100) is developed by SEMPURION for Dry-etched wafers and substrates as a Carrier / Wafer product.Key advantage: Efficient removal of polymer residues after dry etch and ashing; water-based with high closed-cup flash point for safe operation at 70°C.. Benchmarked against Industry-standard dry-etch residue removal, offered as a domestic alternative. Key features: Water-based system with high closed-cup flash point; safe for 70°C high-temperature operation. Typical process: Ready-to-use (RTU); immersion, spray or ultrasonic at 55–70°C for 5–15 min (heavy residue: 70°C ultrasonic 15 min); DI water rinse 2–3 times.

Quick Specs

Benchmark
Industry-standard dry-etch residue removal, offered as a domestic alternative
Application
Dry-etched wafers and substrates
Materials
Dry-etched wafers/substrates

Features

Water-based system with high closed-cup flash point; safe for 70°C high-temperature operation

Process & Usage

Ready-to-use (RTU); immersion, spray or ultrasonic at 55–70°C for 5–15 min (heavy residue: 70°C ultrasonic 15 min); DI water rinse 2–3 times

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