SP-Clear Organic
SP-Clear Organic — Mildly Alkaline Organic-removal Cleaner
Flagship of the SP-Clear series: primary product for organic contamination and VOC removal on FOUP/FOSB — 1:4 dilution, pH 8.5–9.5, clean at 55–75 °C for 5–10 min; HSP verified RED=0.59
Technical Description
SP-Clear Organic is the flagship of SEMPURION's SP-Clear semiconductor cleaning series, targeting organic contamination and VOC removal on FOUP/FOSB in PC ESD / CBM ESD. Supplied as a light-yellow clear concentrate diluted 1:4 (concentrate : DI water), it has passed HSP (Hansen solubility parameter) matching with RED=0.59 — excellent solvency for photoresist outgassing products.
A dedicated surfactant system works with PM + Butyl Carbitol dual solvents: the working solution is pH 8.5–9.5, the safe upper limit for PC ESD material; recommended working temperature is 55–75 °C, where higher temperature boosts organic removal, and cleaning takes 5–10 minutes — as the flagship product it deserves the full reaction time. Foam height is below 5 mm (Ross-Miles at 70 °C) with surface tension below 28 mN/m. Removal spectrum: photoresist outgassing residue and VOC excellent; organic film good (mild alkali + solvent synergy); particles good when combined with pre-wash (surfactant + chelator dispersion).
The standard process is: pre-rinse (DI water, 1–2 min) → chemical clean (55–75 °C, 5–10 min — the critical step, hold time and temperature) → DI rinse (2–4 cycles, UPW recommended) → N₂ blow-dry. The product contains organic solvents: gloves are recommended and the area should stay ventilated; flash point is above 61 °C, so it is not a flammable liquid. Packaging is 5 / 25 / 200 kg drums and 1000 kg IBC, stored sealed and cool at 5–35 °C with a 12-month unopened shelf life.
Positioning & Scope
| Positioning | Flagship product for organic contamination / VOC removal on FOUP/FOSB |
| Suitable for | FOUP & FOSB in PC ESD / CBM ESD |
| Form | Light-yellow clear liquid (concentrate) |
Dilution
| Ratio | Procedure | Working solution |
|---|---|---|
| 1 : 4 (concentrate : DI water) | 1 part concentrate + 4 parts DI water, stir until uniform | 5 parts working solution |
Working-solution parameters
| Parameter | Value | Notes |
|---|---|---|
| pH | 8.5 – 9.5 | Mildly alkaline — at the safe upper limit for PC ESD |
| Operating temp. | 55 – 75 °C | Higher temperature boosts organic removal |
| Cleaning time | 5 – 10 min | Flagship product — allow full reaction time |
| Foam height | < 5 mm | Ross-Miles test at 70 °C |
| Surface tension | < 28 mN/m | Contains PM + Butyl Carbitol dual solvents |
Cleaning process
- 1Pre-rinse (DI water, 1 – 2 min)
- 2SP-Clear Organic chemical clean (55 – 75 °C, 5 – 10 min) ← critical: hold time and temperature
- 3DI rinse (2 – 4 cycles, UPW)
- 4N₂ blow-off drying
Verified: passed HSP evaluation (RED = 0.59) — excellent solvency for photoresist outgassing residues.
Contaminants addressed
| Contaminant | Removal | Notes |
|---|---|---|
| Photoresist outgassing residue | Excellent | HSP verified, RED = 0.59 |
| VOC | Excellent | PM + Butyl Carbitol dual dissolution |
| Organic film | Good | Mild alkali + solvent synergy |
| Particles (with pre-wash) | Good | Surfactant + chelator dispersion |
Packaging & Storage
| Packaging | Drums 5 / 25 / 200 kg; IBC bulk 1000 kg |
| Order code | SCP-OG-05 / 25 / 200 | SCP-OG-1000 (IBC) |
| Storage | Sealed, cool and dry at 5 – 35 °C |
| Shelf life | 12 months (unopened) |
Safety notes
- ·Contains organic solvents (PM + Butyl Carbitol); gloves recommended
- ·Keep the working area well ventilated (slight solvent volatilisation)
- ·Flash point > 61 °C — not classified as a flammable liquid
- ·If it gets in the eyes, rinse with plenty of water for 15 minutes
Same series (SP-Clear)
The SP-Clear series is segmented by carrier material and contaminant type; used together it covers the full cleaning chain for FOUP / FOSB / PFA carriers / mask boxes.
Introduction
SP-Clear Organic — Mildly Alkaline Organic-removal Cleaner (SP-Clear Organic) is developed by SEMPURION for Removal of organic contamination, photoresist outgassing residue and VOC from FOUP and FOSB in PC ESD / CBM ESD as a Carrier / Wafer product.Key advantage: Flagship of the SP-Clear series: primary product for organic contamination and VOC removal on FOUP/FOSB — 1:4 dilution, pH 8.5–9.5, clean at 55–75 °C for 5–10 min; HSP verified RED=0.59. Benchmarked against Industry-standard organic cleaning for FOUP/FOSB, offered as a domestic alternative. Key features: Passed HSP (Hansen solubility parameter) matching with RED=0.59 — excellent solvency for photoresist outgassing products; contains PM + Butyl Carbitol dual solvents, surface tension <28 mN/m; mildly alkaline pH 8.5–9.5 at the safe upper limit for PC ESD; 55–75 °C working temperature boosts organic removal; foam <5 mm (Ross-Miles at 70 °C); flash point >61 °C — not a flammable liquid. Typical process: Process: pre-rinse (DI water, 1–2 min) → chemical clean (55–75 °C, 5–10 min; critical step — hold time and temperature) → DI rinse (2–4 cycles, UPW) → N₂ blow-dry. Removal spectrum: photoresist outgassing residue excellent (HSP RED=0.59), VOC excellent, organic film good, particles good (with pre-wash). Dilution: 1 part concentrate + 4 parts DI water = 5 parts working solution. Packaging: 5 / 25 / 200 kg drums (SCP-OG-05/25/200), 1000 kg IBC (SCP-OG-1000); storage 5–35 °C sealed and cool, 12 months unopened; keep the working area ventilated.
Quick Specs
Features
Passed HSP (Hansen solubility parameter) matching with RED=0.59 — excellent solvency for photoresist outgassing products; contains PM + Butyl Carbitol dual solvents, surface tension <28 mN/m; mildly alkaline pH 8.5–9.5 at the safe upper limit for PC ESD; 55–75 °C working temperature boosts organic removal; foam <5 mm (Ross-Miles at 70 °C); flash point >61 °C — not a flammable liquid
Process & Usage
Process: pre-rinse (DI water, 1–2 min) → chemical clean (55–75 °C, 5–10 min; critical step — hold time and temperature) → DI rinse (2–4 cycles, UPW) → N₂ blow-dry. Removal spectrum: photoresist outgassing residue excellent (HSP RED=0.59), VOC excellent, organic film good, particles good (with pre-wash). Dilution: 1 part concentrate + 4 parts DI water = 5 parts working solution. Packaging: 5 / 25 / 200 kg drums (SCP-OG-05/25/200), 1000 kg IBC (SCP-OG-1000); storage 5–35 °C sealed and cool, 12 months unopened; keep the working area ventilated
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