TGV-CU1
TGV-CU1 Neutral Ultrasonic Cleaner for Through-Glass Vias
Cleans inside high-aspect-ratio through-glass vias; surface tension below 30 mN/m lets the bath penetrate straight to the via bottom.
Technical Description
TGV-CU1 is a neutral ultrasonic cleaning chemistry from Shengpu Chemical developed for through-glass via (TGV) glass substrates in precision semiconductor processes. Benchmarked against Parker PK-LCG255 on the neutral route, its literature-validated surface tension below 30 mN/m allows the bath to flood to the bottom of 10 µm vias at 50:1 aspect ratio for reliable ultrasonic cleaning, supporting yield and cleanliness in semiconductor manufacturing and advanced packaging lines.
Introduction
TGV-CU1 Neutral Ultrasonic Cleaner for Through-Glass Vias (TGV-CU1) is developed by SEMPURION for TGV glass substrates as a TGV / Process product.Key advantage: Cleans inside high-aspect-ratio through-glass vias; surface tension below 30 mN/m lets the bath penetrate straight to the via bottom.. Benchmarked against Parker PK-LCG255 (neutral route). Key features: Surface-tension design validated in academic literature; cleans vias of 10 µm diameter at 50:1 aspect ratio. Typical process: Ultrasonic, 40–60°C.
Quick Specs
Features
Surface-tension design validated in academic literature; cleans vias of 10 µm diameter at 50:1 aspect ratio
Process & Usage
Ultrasonic, 40–60°C
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- Phone
- +86 769-82786068
- sales@sempurion.com
- Website
- www.sempurion.com
- Address
- Songshan Lake, Dongguan, Guangdong, China