EBR-100
EBR-100 Wafer Edge Bead Remover
Removes edge bead residue after lithography; electronic-grade purity for yield protection.
Technical Description
EBR-100 is an electronic-grade edge bead remover from Shengpu Chemical that cleans photoresist residue from wafer edges after lithography. Benchmarked against Parker EBR agents, it delivers electronic-grade purity (metals <10 ppb, water <500 ppm) with no diffusion band, no white frost after drying and pattern-safe performance (CD change <2%), positioning itself as a yield guardian in semiconductor manufacturing and advanced packaging lines.
Introduction
EBR-100 Wafer Edge Bead Remover (EBR-100) is developed by SEMPURION for Photolithography wafers (edge bead removal) as a Carrier / Wafer product.Key advantage: Removes edge bead residue after lithography; electronic-grade purity for yield protection.. Benchmarked against Parker edge bead remover. Key features: Electronic-grade purity (metals <10 ppb, water <500 ppm); no diffusion band at edge; no white residue after drying; pattern-safe (CD change <2%). Typical process: Used neat via EBR nozzle coating/spray on the wafer edge, 10–60 s at room temperature (30–35°C heating in a closed chamber accelerates); spin-dry at 1000–3000 rpm for 10–30 s; keep operating temperature <25°C away from ignition sources.
Quick Specs
Features
Electronic-grade purity (metals <10 ppb, water <500 ppm); no diffusion band at edge; no white residue after drying; pattern-safe (CD change <2%)
Process & Usage
Used neat via EBR nozzle coating/spray on the wafer edge, 10–60 s at room temperature (30–35°C heating in a closed chamber accelerates); spin-dry at 1000–3000 rpm for 10–30 s; keep operating temperature <25°C away from ignition sources
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- Phone
- +86 769-82786068
- sales@sempurion.com
- Website
- www.sempurion.com
- Address
- Songshan Lake, Dongguan, Guangdong, China