DB-100
DB-100 Temporary Bonding De-Bonding Residue Cleaner
Removes adhesive residue left after temporary bonding/de-bonding; water-based with a closed-cup flash point above 60°C for safe heated operation.
Technical Description
DB-100 is a water-based cleaner from Shengpu Chemical that removes adhesive residue after temporary bonding de-bonding of thinned wafers and carrier substrates. Benchmarked against SUSS/Brewer Science companion de-bonding cleaners, its formulation offers a closed-cup flash point above 60°C for safe heated operation by immersion or spray at 50–70°C, supporting yield and cleanliness in semiconductor manufacturing and advanced packaging lines.
Introduction
DB-100 Temporary Bonding De-Bonding Residue Cleaner (DB-100) is developed by SEMPURION for Thinned wafers and carrier substrates as a Carrier / Wafer product.Key advantage: Removes adhesive residue left after temporary bonding/de-bonding; water-based with a closed-cup flash point above 60°C for safe heated operation.. Benchmarked against SUSS / Brewer Science companion de-bonding cleaners. Key features: Water-based system with closed-cup flash point >60°C; safe for heated operation. Typical process: Immersion or spray at 50–70°C for 5–20 min (silicone adhesives may be pre-swollen 5 min before bath); DI water rinse 2–3 times; megasonic rinse if needed.
Quick Specs
Features
Water-based system with closed-cup flash point >60°C; safe for heated operation
Process & Usage
Immersion or spray at 50–70°C for 5–20 min (silicone adhesives may be pre-swollen 5 min before bath); DI water rinse 2–3 times; megasonic rinse if needed
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- Phone
- +86 769-82786068
- sales@sempurion.com
- Website
- www.sempurion.com
- Address
- Songshan Lake, Dongguan, Guangdong, China