SP-Clear PreWash — Neutral Pre-Cleaner for FOUP/FOSB
Semiconductor & PackagingCarrier / Wafer

SP-Clear PreWash

SP-Clear PreWash — Neutral Pre-Cleaner for FOUP/FOSB

Dedicated pre-cleaner for particle removal on FOUP/FOSB: concentrate diluted 1:4, neutral pH 6.5–7.5, chemical clean at 50–65 °C for 3–8 min, spray-safe with <5 mm foam

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Technical Description

SP-Clear PreWash is the neutral pre-cleaner in SEMPURION's SP-Clear semiconductor cleaning series, dedicated to particle removal on FOUP/FOSB in PC ESD / CBM ESD / PEI ESD. It is a colorless clear concentrate diluted 1:4 (concentrate : DI water) — 1 part concentrate plus 4 parts DI water gives 5 parts working solution, with no heating or pre-dissolving.

The working solution is pH 6.5–7.5; the neutral system is fully safe for PC ESD. Recommended operating temperature is 50–65 °C, within the 80 °C FOUP material limit with headroom; cleaning takes 3–8 minutes depending on contamination. Foam height is below 5 mm (Ross-Miles), making it suitable for spray cleaning, and surface tension below 30 mN/m gives good wetting and penetration to help particles release from the carrier surface.

The standard process is: pre-rinse (DI water, 1–2 min) → chemical clean (50–65 °C, 3–8 min) → DI rinse (2–4 cycles, UPW recommended) → drying (spin + hot air / N₂ blow-off). The product is neutral and non-irritating; gloves are recommended, and it should not be stored with strong oxidisers. Packaging is 5 / 25 / 200 kg drums and 1000 kg IBC, stored sealed, cool and dry at 5–35 °C with a 12-month unopened shelf life.

01

Positioning & Scope

PositioningDedicated pre-clean for particle removal on FOUP/FOSB
Suitable forFOUP & FOSB in PC ESD / CBM ESD / PEI ESD
FormColorless clear liquid (concentrate)
02

Dilution

RatioProcedureWorking solution
1 : 4 (concentrate : DI water)1 part concentrate + 4 parts DI water, stir until uniform5 parts working solution

Example: 5 kg concentrate + 20 kg DI water = 25 kg working solution; 25 kg + 100 kg = 125 kg

03

Working-solution parameters

ParameterValueNotes
pH6.5 – 7.5Neutral — fully safe for PC ESD
Operating temp.50 – 65 °CFOUP material limit is 80 °C, leaving headroom
Cleaning time3 – 8 minAdjust to contamination level
Foam height< 5 mmRoss-Miles method — safe for spray cleaning
Surface tension< 30 mN/mGood wetting and penetration
04

Cleaning process

  1. 1Pre-rinse (DI water, 1 – 2 min)
  2. 2SP-Clear PreWash chemical clean (50 – 65 °C, 3 – 8 min)
  3. 3DI rinse (2 – 4 cycles, UPW)
  4. 4Drying (spin + hot air / N₂ blow-off)
05

Packaging & Storage

PackagingDrums 5 / 25 / 200 kg; IBC bulk 1000 kg
Order codeSCP-PW-05 / 25 / 200 | SCP-PW-1000 (IBC)
StorageSealed, cool and dry at 5 – 35 °C
Shelf life12 months (unopened)
06

Safety notes

  • ·Neutral and non-irritating; gloves recommended during handling
  • ·Do not store together with strong oxidisers
  • ·If it gets in the eyes, rinse with plenty of water for 15 minutes
  • ·Dispose of waste liquid per local environmental regulations
07

Same series (SP-Clear)

The SP-Clear series is segmented by carrier material and contaminant type; used together it covers the full cleaning chain for FOUP / FOSB / PFA carriers / mask boxes.

Introduction

SP-Clear PreWash — Neutral Pre-Cleaner for FOUP/FOSB (SP-Clear PreWash) is developed by SEMPURION for Particle pre-cleaning of FOUP and FOSB in PC ESD / CBM ESD / PEI ESD; pre-wash step on high-cleanliness wet-process carrier cleaning lines as a Carrier / Wafer product.Key advantage: Dedicated pre-cleaner for particle removal on FOUP/FOSB: concentrate diluted 1:4, neutral pH 6.5–7.5, chemical clean at 50–65 °C for 3–8 min, spray-safe with <5 mm foam. Benchmarked against Industry-standard pre-cleaning for FOUP/FOSB, offered as a domestic alternative. Key features: Concentrate used at 1:4 (concentrate:DI water) with no heating or pre-dissolving; neutral pH 6.5–7.5, fully safe for PC ESD; working temperature 50–65 °C, inside the 80 °C FOUP material limit with headroom; cleaning time only 3–8 min, adjusted to contamination level; foam height <5 mm (Ross-Miles), safe for spray cleaning; surface tension <30 mN/m for good wetting and penetration. Typical process: Process: pre-rinse (DI water, 1–2 min) → SP-Clear PreWash chemical clean (50–65 °C, 3–8 min) → DI rinse (2–4 cycles, UPW) → drying (spin + hot air / N₂ blow-off). Dilution: 1 part concentrate + 4 parts DI water gives 5 parts working solution (example: 5 kg concentrate + 20 kg DI water = 25 kg). Packaging: 5 / 25 / 200 kg drums (SCP-PW-05/25/200), 1000 kg IBC (SCP-PW-1000); storage: sealed, cool and dry at 5–35 °C, 12 months unopened.

Quick Specs

Benchmark
Industry-standard pre-cleaning for FOUP/FOSB, offered as a domestic alternative
Application
Particle pre-cleaning of FOUP and FOSB in PC ESD / CBM ESD / PEI ESD; pre-wash step on high-cleanliness wet-process carrier cleaning lines
Materials
FOUP & FOSB in PC ESD / CBM ESD / PEI ESD

Features

Concentrate used at 1:4 (concentrate:DI water) with no heating or pre-dissolving; neutral pH 6.5–7.5, fully safe for PC ESD; working temperature 50–65 °C, inside the 80 °C FOUP material limit with headroom; cleaning time only 3–8 min, adjusted to contamination level; foam height <5 mm (Ross-Miles), safe for spray cleaning; surface tension <30 mN/m for good wetting and penetration

Process & Usage

Process: pre-rinse (DI water, 1–2 min) → SP-Clear PreWash chemical clean (50–65 °C, 3–8 min) → DI rinse (2–4 cycles, UPW) → drying (spin + hot air / N₂ blow-off). Dilution: 1 part concentrate + 4 parts DI water gives 5 parts working solution (example: 5 kg concentrate + 20 kg DI water = 25 kg). Packaging: 5 / 25 / 200 kg drums (SCP-PW-05/25/200), 1000 kg IBC (SCP-PW-1000); storage: sealed, cool and dry at 5–35 °C, 12 months unopened

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