BPW-100
BPW-100 Post-Bump-Plating Cleaner
Low-foam mild-alkaline cleaner removing residual plating solution and particles after bump plating.
Technical Description
BPW-100 is a low-foam, mild-alkaline cleaner from Shengpu Chemical that removes residual plating solution and particles from bumped wafers after electroplating. Benchmarked against Tianhong companion chemistries used on Taiwan plating lines, it is applied by spray or ultrasonic from room temperature to 45°C followed by DI and hot-DI rinsing, supporting yield and cleanliness in semiconductor manufacturing and advanced packaging lines.
Introduction
BPW-100 Post-Bump-Plating Cleaner (BPW-100) is developed by SEMPURION for Bumped wafers after electroplating as a Carrier / Wafer product.Key advantage: Low-foam mild-alkaline cleaner removing residual plating solution and particles after bump plating.. Benchmarked against Tianhong (Taiwan plating-line companion chemistry). Key features: Low-foam mild-alkaline system; removes plating residues and particles without attacking bump structures. Typical process: Spray or ultrasonic at room temperature to 45°C for 3–8 min; DI water rinse 2–3 times plus hot DI rinse (50°C, 1–2 min).
Quick Specs
Features
Low-foam mild-alkaline system; removes plating residues and particles without attacking bump structures
Process & Usage
Spray or ultrasonic at room temperature to 45°C for 3–8 min; DI water rinse 2–3 times plus hot DI rinse (50°C, 1–2 min)
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- Phone
- +86 769-82786068
- sales@sempurion.com
- Website
- www.sempurion.com
- Address
- Songshan Lake, Dongguan, Guangdong, China