DBL-100
DBL-100 Blue/UV Tape Residue Remover for Wafer Dicing
One-step removal of blue/UV tape adhesive residue after wafer dicing, balancing stripping power with wafer/chip safety.
Technical Description
DBL-100 is a cleaning chemistry from Shengpu Chemical developed for wafers and chips after dicing to remove blue/UV tape adhesive residue. Benchmarked against industry-standard mild-alkaline tape-residue cleaners, it combines effective stripping with wafer/chip safety and a chip-level ionic residue target below 1.5 µg/cm², supporting yield and cleanliness in semiconductor manufacturing and advanced packaging lines.
Introduction
DBL-100 Blue/UV Tape Residue Remover for Wafer Dicing (DBL-100) is developed by SEMPURION for Wafers and chips after dicing as a Carrier / Wafer product.Key advantage: One-step removal of blue/UV tape adhesive residue after wafer dicing, balancing stripping power with wafer/chip safety.. Benchmarked against Industry-standard mild-alkaline blue/UV tape residue cleaners. Key features: Balances residue-stripping power with wafer/chip safety; chip-level ionic residue target <1.5 µg/cm². Typical process: Immersion or ultrasonic cleaning 3–10 min; chip-level ionic residue target <1.5 µg/cm².
Quick Specs
Features
Balances residue-stripping power with wafer/chip safety; chip-level ionic residue target <1.5 µg/cm²
Process & Usage
Immersion or ultrasonic cleaning 3–10 min; chip-level ionic residue target <1.5 µg/cm²
Need samples or datasheets?
Contact us for detailed specs, MSDS and sample support for DBL-100
Need technical support or a sample?
Tell us your substrate, contamination and process conditions — our process engineers will recommend a grade and arrange sample validation.
- Phone
- +86 769-82786068
- sales@sempurion.com
- Website
- www.sempurion.com
- Address
- Songshan Lake, Dongguan, Guangdong, China