Solutions
Find chemicals by your process
Follow your process chain — cleaning, etching, developing, stripping — to locate the right chemistry fast.
Semiconductor & Advanced Packaging Solutions
Electronic-grade chemistries covering carrier cleaning, wafer processing, TGV glass substrates and metal etching for semiconductor and advanced packaging.
Display Module Solutions
Gentle, high-efficiency chemistries for display module rework de-gumming, process cleaning, developing, etching and glass thinning without harming ITO/polarizer.
Optical Glass & Sapphire Solutions
Full-process chemistries for glass/sapphire: process cleaning, grinding lubrication, screen-ink stripping, coating removal and lamination rework.
Metal & Plastic Surface Treatment
Degreasing, dewaxing, fine-grinding cleaning, PVD stripping and passivation for hardware, plastic and stainless parts.
SMT Stencil & Electronics Cleaning
Aqueous and semi-aqueous cleaners for SMT stencils and PCBA flux/solder-paste residue, balancing cleaning power and VOC compliance.
FAQs & Guides
All guides →The questions customers ask most when selecting or debugging a process — with technical points, real specifications and matching models.
What replaces graphite molds for glass hot bending when mold life is too short?
Graphite molds degrade by oxidation/carbonisation at high temperature. The alternative is carbon-based composite molds such as CC-3D: 750 °C+ service temperature and 50×+ the service life of graphite.
Read answer →Which mold for 750 °C microcrystalline glass bending, and why does graphite carbonise?
Microcrystalline glass bending needs 750 °C+. Graphite oxidises and carbonises badly there; CC-3D carbon-based composite molds do not, and last 50×+ longer.
Read answer →CC-3D carbon-based composite mold: specifications and service-life advantage
CC-3D key figures: carbon-based composite (carbonfibre-reinforced ceramic matrix); 750 °C+ service temperature; 3D hyperboloid/large-curvature forming; ~680–700 °C for normal cover glass; 50×+ graphite mold life.
Read answer →How to select cleaning chemistry for FOUP / FOSB carriers
Select by carrier material (PC ESD / CBM ESD / PEI ESD differ in temperature and alkali tolerance), then by contaminant (particles / organics / ions / resist residue). SP-Clear covers this with 5 grades.
Read answer →How to clean post-CMP wafers without attacking Cu/W interconnect?
The key is a mild-alkaline window plus metal-ion capture — overly strong alkali or overly strong complexing attacks copper. PCMP-100 runs at pH 9.0–9.8 with acceptance targets of <0.1 particles/cm² (≥0.16 μm) and Na/Cu/Fe < 10 ppb.
Read answer →Domestic alternative for post-thinning wafer cleaning
TW-100, an SC1-improved system, suits post-thinning cleaning: two-component 5X concentrate at A:B:DI = 1:1:5 mixed fresh, 40–60 °C for 5–10 min, with targets of <100 particles/wafer (≥0.3 μm) and Fe/Cu/Zn < 10 ppb.
Read answer →Which chemistry for TGV via etching — fluorine or hot-alkali route?
For the femtosecond-laser-modification + hot-alkali selective etch route, GE-K1 runs at 110±5 °C: the modified zone is selectively removed into a via while bulk glass is barely etched, and it avoids highly toxic hydrofluoric acid.
Read answer →Cleaning coated optical glass without damaging the coating or overflowing the tank
Two hard constraints: chemistry mild on the deposited film (neutral system) and no foaming in spray operation. ZL-001 uses a neutral system (3–10% working solution) with a low-foam design, cleaning in 1–3 min at 45–50 °C without tank overflow or spray-pressure loss.
Read answer →Can a vacuum-deposited chrome coating (mirror-silver finish) be stripped off glass without strong acid or hydrofluoric acid?
Yes. For vacuum-deposited chrome coatings (mirror-silver finish) on glass, J360 uses an ambient-temperature eco-friendly acidic route free of hydrofluoric acid and potassium ferricyanide, stripping in 2–5 min by ambient immersion or spray, replacing traditional strong-acid systems that usually need heating.
Read answer →How to remove stubborn screen-print ink from phone glass?
Aqueous alkaline boil-off often fails on stubborn screen-print ink. Match the ink system: L506 for TOYO inks (alkali + penetrant dual channel); BL-7M056-V2 for high-volume back-cover/frame stripping (80 °C, ~7 min, 1581 parts validated); L515 high-solvent custom grades for unusual inks.
Read answer →How to de-bond OCA/laminating adhesive without damaging the AF coating?
The key is the solvent route plus wetting design: an aromatic-alcohol penetrant system with non-ionic wetting components speeds interfacial spreading and penetration while protecting the AF coating throughout (L715 / L716).
Read answer →How to clean oil and coolant residue before curved-glass hot bending?
Pre-bending cleaning must remove machining oils and coolant residue; otherwise they convert into pits, haze and mold contamination in the hot zone. L18S is a medium-strong alkaline aqueous system that handles both in one step.
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