Selection guides & process knowledge

A.Aqueous/semi-aqueous formulas rely on surfactants and polar builders; without thorough rinsing they can leave white residue or affect subsequent bonding/soldering interfaces.

A.PFA/PTFE/PVDF withstand nearly all chemistry up to 160°C and can take pH 12.8-13.2 hot alkali (SP-Clear PFA); PC carriers hydrolyze and haze under hot alkali, requiring neutral/mild systems such as SP-Clear PreWash (pH 6.5-7.5).

A.Common endpoints: potential jump (Ti 500nm ~4-8 min, stop at jump, over-etch ≤10%), visual clearing (Ti gone, glass exposed), or rate-time estimate. Calibrate on coupons first.

A.Yes — XT52 is a dual-function de-ink/de-strip for optical glass. But single-purpose ink strippers (L506/SP-YN25) shouldn't be mixed with chelating strip systems to avoid window interference.

A.TW-100 is a two-part SC1-improved system (alkali and oxidizer kept separate). Fresh mixing prevents runaway exotherm and preserves activity — bath life is 4-8 h.

A.Develop rate is temperature-sensitive: RD-D1 needs 23±0.5°C, CF-D1 23±1°C — drift directly changes CD and uniformity, causing over- or under-development.

A.ITO is an amphoteric, weakly acidic oxide, so acid systems (HCl, oxalic or modified blends) react gently with controllable undercut and can be buffered/complexed to tune rate and uniformity; alkali attacks both glass and ITO with poor undercut control, so it is not used for fine patterning.

A.The laser-modify + wet-etch route can reach microvias under 5µm with aspect ratios typically above 1:10; the exact limit depends on the laser/modification window and etchant selectivity, so calibrate on coupons first.

A.Not exactly. Degreasing targets stamping/cutting oils via surfactant emulsification or saponification; dewaxing targets solid buffing wax and generally needs higher temperature with strong-alkali saponification, sometimes ultrasonics. Identify the soil first to avoid the wrong route.

A.Graphite oxidises in hot oxygen-bearing environments; above 750 °C (needed for microcrystalline glass) oxidation and carbonisation accelerate, with thermal deformation and accuracy drift collapsing mold life. At ~680–700 °C for normal cover glass it still holds up.

A.CC-3D lasts more than 50× a graphite mold, without oxidation/carbonisation at 750 °C+ and with low thermal deformation and stable accuracy.

A.Carrier cleaning lines are usually spray-based; foam causes pump cavitation, pressure loss and even overflow, wrecking uniformity. SP-Clear PreWash/Organic hold foam height below 5 mm (Ross-Miles) for spray safety.

A.Haze is fundamentally ionic residue: ammonium (NH₄⁺) and sulfate (SO₄²⁻) residues form fog-like contamination during long storage, so ion control — not just particle removal — is the primary goal for reticle boxes, at tighter cleanliness levels than FOUP.

A.Yes — for vacuum-deposited chrome coatings (mirror-silver finish) on glass, J360 uses an ambient-temperature eco-friendly acidic route free of HF and potassium ferricyanide, stripping in 2–5 min by ambient immersion or spray with no heating.

A.A deposited film cannot tolerate strong acid, strong alkali or high temperature — it damages, loses gloss or degrades. Post-coating cleaning needs a neutral system (e.g. ZL-001 at neutral pH, 45–50 °C, 1–3 min).

A.It depends on the resin: alkali-hydrolysable resins suit dual-channel alkali plus penetrant (L506 for TOYO inks); highly crosslinked or solvent-borne resins often need high-solvent systems (custom L515). For volume stripping see BL-7M056-V2 (80 °C, ~7 min, 1581 parts validated).

A.Generic systems can attack the AF coating. An aromatic-alcohol penetrant system with non-ionic wetting components (L715 / L716) protects AF throughout; use AF appearance and contact angle as acceptance criteria.

A.Post-thinning cleaning is a cleaning-power vs thin-wafer-safety problem: abrasives (SiC/diamond/Al₂O₃), metals (Fe/Cu/Zn from platens, carriers, blades) and organics (coolant, grinding wax) coexist on a wafer with less thermal budget, so conventional hot strong alkali is risky. TW-100 follows an SC1-improved route: oxidation plus alkaline synergy lifts particles and captures metal ions into the liquid phase at a reduced alkali concentration and temperature window. Three engineering points: (1) two-component 5X concentrate mixed fresh at A:B:DI = 1:1:5 with 4–8 h bath life; (2) mixing exotherm ≤10 °C from 25 °C for on-site safety; (3) targets of <100 particles/wafer (≥0.3 μm), Fe/Cu/Zn <10 ppb and AFM Ra no worse than pre-clean.

A.ITO patterning selection comes down to three factors: chemistry route (chlorine-free vs chlorine-based), selectivity to photoresist and black matrix, and how etch rate tracks temperature — unpredictable rates make cycle times hard to lock. ITO-E1's main route is a buffered-organic system: chlorine-free, no metal-ion contamination, with excellent selectivity to glass / photoresist / black matrix (ITO-to-photoresist > 10:1), a mainstream route validated across vendor, patent and academic sources and widely replacing traditional inorganic strong acid. The alternative is a classic inorganic-acid fast-etch system, 2–3× faster, with per-film rate calibration. Multi-layer metal lines pair with Cu-Mo1 (Mo/Al etchant, mixed-acid route, Mo barrier and aluminium wiring for 4K2K panels, calibratable rate ratio).

A.Degreasing after CNC must be matched to the substrate — the wrong grade damages parts. Aluminium tolerates little alkali, so it needs an aqueous alkaline system designed around aluminium corrosion resistance (AL-CNC1: alkali-based with inorganic builders and wetting components for machining oil and coolant residue). Stainless steel takes stronger alkaline conditions; SS-D1 is recommended at 10% and 55 °C for 1 minute. Downstream steps pair as follows: L573 for PVD coating stripping on metal parts (alkaline system with ion control and metal-protection components to limit substrate attack); L30 for passivating stainless steel and aluminium (fluorine-containing acidic system combining activation and film formation); and BLG-PS023 anti-static agent for blasting (abrasive additive; 0.5–1.0% dosage markedly cuts friction charging and suppresses dust adhesion and abrasive agglomeration).

A.The core conflict in post-CMP cleaning is cleaning thoroughly without attacking Cu/W interconnect — overly strong alkali or complexing attacks copper. Three residue classes remain: slurry abrasives (SiO₂/CeO₂ colloids, 30–150 nm), by-product metal ions (Cu²⁺/W/Ta) and the slurry's organic additive film. PCMP-100 works inside a mild-alkaline window (pH 9.0–9.8 at 1:4, 40–55 °C, 5–10 min, megasonic or spray) using ion-control components to capture Cu²⁺/Fe³⁺ into the liquid phase and dispersing components to prevent abrasive re-agglomeration; final filtration is 0.2 μm. Targets: <0.1 particles/cm² (≥0.16 μm) after cleaning and Na/Cu/Fe <10 ppb after rinsing, with rinsing executed in 2–3 complete cycles.

A.After dry etching (RIE/ICP) and ashing, four residue classes usually coexist: CₓFᵧ fluorocarbon polymers (sidewall and bottom deposition — the most damaging, since a dense sidewall layer affects subsequent via fill and contact resistance), TiN/Ta/W/Al metal-oxide particulates, Cl⁻/F⁻ halogens, and carbonised film after ashing. Two industry routes exist: aggressive hydroxylamine systems and mild amine-plus-glycol-ether systems. DER-100 takes the mild route and is used as supplied, combining high-purity solvent dissolution of polymers with ion control to remove polymers and oxide particulates, while the aqueous system lets halogen residues be rinsed away thoroughly — the value of a water-based system — remaining safe for sensitive structures with headroom at elevated temperature.

A.Glass and sapphire CNC grinding concentrates heat fast in the grinding zone while the swarf is hard, so the fluid's cooling and lubricating capability is a hard requirement: insufficient cooling causes local thermal stress and edge micro-cracks, while poor lubrication accelerates wheel wear and surface scratching. SEMPURION glass grinding fluid is an aqueous system (pale yellow, transparent) containing polyol and ester lubricant components, dedicated to cooling and lubricating the grinding zone and used alongside the same line's cleaning and lapping products. Concentration, flow rate and process window are set against on-site equipment and workpieces.

A.The graphite tray problem is not wear but high-temperature oxidation and structural degradation: under prolonged sintering or heat treatment it oxidises, sheds particles and deforms — the carbon dust contaminates furnace and parts, and frequent replacement raises cost. CC-HOT uses a carbon-based composite as a high-temperature load fixture/tray, replacing graphite and some metal fixtures for ceramic and powder-metallurgy sintering, metal heat treatment and vacuum furnaces. Characteristics: high-temperature resistance with high strength retention; low thermal deformation and stable dimensions; strong thermal-shock and cycling tolerance; longer life and less particle shedding than graphite; lightweight with high load ratio. Specify by load weight, peak temperature and furnace atmosphere.

A.Residue after dicing and thinning comes from blue tape and UV tape — both acrylic PSA adhesives. They differ in use (blue tape for dicing fixation; UV tape for thinning plus dicing, with adhesion dropping after UV exposure) but both leave residue on the wafer backside and die surface, causing cosmetic defects and downstream die-attach and bonding failures. The difficulty is the narrow metal-safety window on a die carrying both aluminium pads and copper leads: aluminium starts corroding at pH 9 and corrodes rapidly at pH 11, while copper accelerates oxidation at pH 10. DBL-100 avoids the strong-alkali hydrolysis route, using solvent dissolution plus a surfactant-mediated mild-alkaline system to remove acrylic PSA residue while respecting the metal safety window, with chip-level cleanliness as the acceptance target (ionic residue < 1.5 μg/cm²) so bonding or die attach can follow straight after rinsing.