SEMPURION 圣普化学
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Selection guides & process knowledge

Practical selection methods and FAQs distilled from real product process data.

10Guides
9FAQs
2Categories

Guides

10 articles
01
Selection Guide

How to Choose a Cleaner: Material → Contamination → Chemistry

Choose a cleaner by matching substrate tolerance and contaminant type — this decides neutral, alkaline, high-alkaline or solvent chemistry.

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02
Selection Guide

Choosing an Etchant: Metal Type & Selectivity Matter

Etchants are metal-specific — Ti, Mo, Ru and W each need their own system; mixing causes attack or loss of control.

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03
Process Guide

Display Rework De-gumming: Cold-soak Essentials

ACF/OCA/lamination rework favors swelling-peel; temperature and soak time determine substrate safety.

2 sectionsRead →
04
Process Guide

Wafer Cleaning: RCA and the SC1/SC2 System

The RCA standard wet process uses SC1 for particles/organics and SC2 for ionic metals, aided by megasonics to lift yield.

3 sectionsRead →
05
Process Guide

TGV Through-Glass Via Etching: Laser Modify + Wet Etch

Glass has no natural etch direction like silicon; TGV uses femtosecond laser modification plus wet etch to achieve high aspect-ratio vias.

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06
Selection Guide

Stencil Cleaning: Aqueous/Semi-aqueous & Flux Residue

Match the flux type and aperture geometry: aqueous/semi-aqueous emulsify and disperse, solvents dissolve — each with trade-offs.

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07
Process Guide

OCA Display Rework: Swell-peel & Substrate Protection

OCA is mostly acrylic/silicone; rework uses swelling to weaken adhesion, and temperature/soak time are the key to substrate safety.

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08
Selection Guide

Optical Glass Cleaning: Grinding, Coating & De-ink/Strip

Optical glass runs cutting, edging, grinding and polishing; cleaning must match each step, and coatings are highly sensitive to strong alkali.

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09
Process Guide

Display ITO Etching & Patterning

ITO is the key transparent conductor in touch/display; etching must balance undercut control with selectivity to the substrate and other films.

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10
Selection Guide

Metal & Plastic Finishing: Dewax, Strip & Deplate

Finish treatment on metal and plastic first identifies the soil (wax/oil/paint/plating), then chooses alkaline, acidic or solvent routes — substrate tolerance is the floor.

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FAQ

9 questions
QWhy must aqueous/semi-aqueous cleaners be rinsed thoroughly?+
A.Aqueous/semi-aqueous formulas rely on surfactants and polar builders; without thorough rinsing they can leave white residue or affect subsequent bonding/soldering interfaces.
QWhy can PFA carriers take strong alkali but PC cannot?+
A.PFA/PTFE/PVDF withstand nearly all chemistry up to 160°C and can take pH 12.8-13.2 hot alkali (SP-Clear PFA); PC carriers hydrolyze and haze under hot alkali, requiring neutral/mild systems such as SP-Clear PreWash (pH 6.5-7.5).
QHow do I detect etch endpoint?+
A.Common endpoints: potential jump (Ti 500nm ~4-8 min, stop at jump, over-etch ≤10%), visual clearing (Ti gone, glass exposed), or rate-time estimate. Calibrate on coupons first.
QCan one bath do both ink stripping and coating stripping?+
A.Yes — XT52 is a dual-function de-ink/de-strip for optical glass. But single-purpose ink strippers (L506/SP-YN25) shouldn't be mixed with chelating strip systems to avoid window interference.
QWhy mix post-thinning cleaner fresh?+
A.TW-100 is a two-part SC1-improved system (alkali and oxidizer kept separate). Fresh mixing prevents runaway exotherm and preserves activity — bath life is 4-8 h.
QWhy control developer temperature strictly?+
A.Develop rate is temperature-sensitive: RD-D1 needs 23±0.5°C, CF-D1 23±1°C — drift directly changes CD and uniformity, causing over- or under-development.
QWhy is ITO typically etched with acid rather than alkali?+
A.ITO is an amphoteric, weakly acidic oxide, so acid systems (HCl, oxalic or modified blends) react gently with controllable undercut and can be buffered/complexed to tune rate and uniformity; alkali attacks both glass and ITO with poor undercut control, so it is not used for fine patterning.
QHow small can a TGV via be made?+
A.The laser-modify + wet-etch route can reach microvias under 5µm with aspect ratios typically above 1:10; the exact limit depends on the laser/modification window and etchant selectivity, so calibrate on coupons first.
QAre dewaxing and degreasing the same?+
A.Not exactly. Degreasing targets stamping/cutting oils via surfactant emulsification or saponification; dewaxing targets solid buffing wax and generally needs higher temperature with strong-alkali saponification, sometimes ultrasonics. Identify the soil first to avoid the wrong route.