Selection Guide

Stencil Cleaning: Aqueous/Semi-aqueous & Flux Residue

Match the flux type and aperture geometry: aqueous/semi-aqueous emulsify and disperse, solvents dissolve — each with trade-offs.

1Residue type sets the route

Rosin/resin fluxes (R/RA/RMA) leave tacky hydrophobic residue needing saponification or solvent penetration; water-soluble residue rinses with neutral aqueous; no-clean leaves less but still affects conductivity. Residue inside aperture walls directly degrades subsequent paste transfer.

2Aqueous vs semi-aqueous vs solvent

Aqueous uses water as main solvent, emulsifying/dispersing insoluble residue into a rinsable state — green and safe but needs rinse and dry. Semi-aqueous adds co-solvent/penetrant to balance solvency and safety. Pure solvents (esp. halogenated) dissolve well and dry fast but are volatile; some are ODS-restricted.

3Cleaning method & acceptance

Automated stencil cleaning uses wet wipe + vacuum + dry wipe: wet removes paste, vacuum pulls residue from apertures, dry removes cleaner. Verify apertures are clear with no white residue, using ionic contamination (ROSE) and magnification when needed.

Need technical support or a sample?

Tell us your substrate, contamination and process conditions — our process engineers will recommend a grade and arrange sample validation.

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