Which chemistry for TGV via etching — fluorine or hot-alkali route?
For the femtosecond-laser-modification + hot-alkali selective etch route, GE-K1 runs at 110±5 °C: the modified zone is selectively removed into a via while bulk glass is barely etched, and it avoids highly toxic hydrofluoric acid.
1The two mainstream routes
The fluorine route etches strongly but carries severe toxicity controls and occupational-health burden; the hot-alkali route is markedly better on controllability, waste treatment and EHS load, with good taper (<1°). Including safety and compliance cost in the total cost comparison often leads lines to trial the hot-alkali route first.
2GE-K1 process parameters
Hot-alkali glass etch system, ~40% effective alkali; 110±5 °C immersion; 10–60 min by modification depth and target via size; etch rate 0.1–0.5 μm/min (6–30 μm/h) at 110 °C depending on laser damage, to be calibrated against the customer's laser recipe; taper <1°.
3Fit and integration
GE-K1 targets TGV via formation on femtosecond-laser-modification lines and links with cleaners and surface conditioners into a complete post-via process chain. Calibrate rate against the customer's laser parameters and run a pilot batch before production.
Need technical support or a sample?
Tell us your substrate, contamination and process conditions — our process engineers will recommend a grade and arrange sample validation.
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