HKC-ACF-N
HKC-ACF-N ACF Residue Remover (Cold-Soak)
Cold-soak removal of ACF adhesive residue without attacking ITO; works at room temperature with no heating equipment.
Technical Description
HKC-ACF-N is an ACF residue remover from Shengpu Chemical for display-module glass ITO areas in COG, FOB and COF assemblies. Benchmarked against mature LINTEC/Resonac/3M ACF removers, it relies on strong solvent penetration to pry open the heat-cured epoxy network so residual adhesive peels off in sheets during room-temperature cold soak, without attacking ITO. Thin residues lift in 5–15 minutes and thick ones in 20–30 (halved with ultrasonic assist), and the product's reproductive-toxicity risk class is disclosed in the MSDS, supporting rework and disassembly processes in display panel/module manufacturing.
Introduction
HKC-ACF-N ACF Residue Remover (Cold-Soak) (HKC-ACF-N) is developed by SEMPURION for Display-module glass ITO (COG / FOB / COF) as a De-gum / De-bond product.Key advantage: Cold-soak removal of ACF adhesive residue without attacking ITO; works at room temperature with no heating equipment.. Benchmarked against LINTEC / Resonac / 3M mature ACF removers (pure or near-pure solvent route). Key features: Strong solvency and penetration — solvent penetrates to pry open the heat-cured epoxy crosslink network, peeling residual adhesive off in sheets by cold soak; supports customer cold-soak process at room temperature; thin residue lifts in 5–15 min, thick residue in 20–30 min; ultrasonic assist halves the time; no heating equipment needed; stays within the ITO safety boundary. Typical process: Cold-soak debonding process — rework flow: heat-peel the FPC/IC, cold-soak until the adhesive layer lifts (thin 5–15 min, thick 20–30 min, halved with ultrasonic assist), wipe gently, rinse in pure water, dry and inspect; rinse thoroughly — residual chemistry may affect downstream processes; reproductive-toxicity risk class disclosed in the MSDS per regulations; follow MSDS for transport, storage and use.
Quick Specs
Features
Strong solvency and penetration — solvent penetrates to pry open the heat-cured epoxy crosslink network, peeling residual adhesive off in sheets by cold soak; supports customer cold-soak process at room temperature; thin residue lifts in 5–15 min, thick residue in 20–30 min; ultrasonic assist halves the time; no heating equipment needed; stays within the ITO safety boundary
Process & Usage
Cold-soak debonding process — rework flow: heat-peel the FPC/IC, cold-soak until the adhesive layer lifts (thin 5–15 min, thick 20–30 min, halved with ultrasonic assist), wipe gently, rinse in pure water, dry and inspect; rinse thoroughly — residual chemistry may affect downstream processes; reproductive-toxicity risk class disclosed in the MSDS per regulations; follow MSDS for transport, storage and use
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- Phone
- +86 769-82786068
- sales@sempurion.com
- Website
- www.sempurion.com
- Address
- Songshan Lake, Dongguan, Guangdong, China