PR-N1 Photoresist Stripper for Advanced Packaging RDL
Display ModuleDe-gum / De-bond

PR-N1

PR-N1 Photoresist Stripper for Advanced Packaging RDL

Strips RDL/semiconductor photoresist by migrating proven ACF-debonding chemistry; copper loss below 0.05 µm/h at 70°C.

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Technical Description

PR-N1 is a photoresist stripper from Shengpu Chemical developed for RDL layers in advanced packaging, migrating the company's mature ACF-debonding technology. Benchmarked against TOK/Feikai-class strippers, it relies on the same swelling-plus-chain-scission mechanism and keeps copper loss below 0.05 µm/h at 70°C. The product carries CLP 1B reproductive-toxicity classification, so heated operations require ventilation and occupational exposure controls, and it serves cleaning, etching and rework steps in display panel/module and packaging processes.

Introduction

PR-N1 Photoresist Stripper for Advanced Packaging RDL (PR-N1) is developed by SEMPURION for Advanced packaging RDL layers as a De-gum / De-bond product.Key advantage: Strips RDL/semiconductor photoresist by migrating proven ACF-debonding chemistry; copper loss below 0.05 µm/h at 70°C.. Benchmarked against TOK / Feikai-class photoresist strippers. Key features: Direct technology transfer from mature ACF debonding; same swelling-plus-chain-scission mechanism; copper loss <0.05 µm/h at 70°C. Typical process: Immersion at 70–80°C for 5–15 min (add 3–5 min ultrasonic for hardened resist); after stripping, transition-rinse with high-purity solvent before DI water to prevent re-deposition of dissolved resist; reproductive-toxicity controlled category (CLP 1B); ventilate and use occupational exposure protection at high temperature.

Quick Specs

Benchmark
TOK / Feikai-class photoresist strippers
Application
Advanced packaging RDL layers
Materials
Advanced packaging RDL

Features

Direct technology transfer from mature ACF debonding; same swelling-plus-chain-scission mechanism; copper loss <0.05 µm/h at 70°C

Process & Usage

Immersion at 70–80°C for 5–15 min (add 3–5 min ultrasonic for hardened resist); after stripping, transition-rinse with high-purity solvent before DI water to prevent re-deposition of dissolved resist; reproductive-toxicity controlled category (CLP 1B); ventilate and use occupational exposure protection at high temperature

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