BD-100
BD-100 Pre-Bonding Cleaner
Precision cleaning before IC/display bonding; halogen-free, phosphorus-free, nitrogen-free and flash-point-free, designed to a no-residue standard.
Technical Description
BD-100 is a pre-bonding cleaner from Shengpu Chemical for display module and IC bonding surfaces. Benchmarked against comparable industry products for COB pre-bonding, it is halogen-, phosphorus-, nitrogen- and flash-point-free and engineered to a no-residue standard — low residue, no whitening and easy rinsing so nothing left at the bonding interface can drag down yield. It removes fingerprints, dust, glass powder and oils from ITO before COG/COF bonding and flux residue before COB wire bonding, and pairs naturally with the ACF remover as the clean-and-rework combination for the same customer process.
Introduction
BD-100 Pre-Bonding Cleaner (BD-100) is developed by SEMPURION for Display modules / IC bonding as a Cleaning / Developing product.Key advantage: Precision cleaning before IC/display bonding; halogen-free, phosphorus-free, nitrogen-free and flash-point-free, designed to a no-residue standard.. Benchmarked against Industry-standard pre-bonding cleaning, offered as a domestic alternative. Key features: Halogen-free, phosphorus-free, nitrogen-free and flash-point-free; suited to both spray and ultrasonic processes; engineered to a no-residue standard — low residue, no whitening, easy rinsing, avoiding residues that directly drag down bond yield; natural companion to the ACF remover: pre-bond cleaning and rework debonding are two steps at the same customer, enabling combined qualification with a single sample covering both applications. Typical process: Precision cleaning before IC/display bonding: removes fingerprints, dust, glass powder and oils from glass ITO areas before COG/COF bonding, and flux residue before COB bare-die bonding (residues directly weaken wire-bond strength); water-based, low-foam, no-residue design.
Quick Specs
Features
Halogen-free, phosphorus-free, nitrogen-free and flash-point-free; suited to both spray and ultrasonic processes; engineered to a no-residue standard — low residue, no whitening, easy rinsing, avoiding residues that directly drag down bond yield; natural companion to the ACF remover: pre-bond cleaning and rework debonding are two steps at the same customer, enabling combined qualification with a single sample covering both applications
Process & Usage
Precision cleaning before IC/display bonding: removes fingerprints, dust, glass powder and oils from glass ITO areas before COG/COF bonding, and flux residue before COB bare-die bonding (residues directly weaken wire-bond strength); water-based, low-foam, no-residue design
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- Phone
- +86 769-82786068
- sales@sempurion.com
- Website
- www.sempurion.com
- Address
- Songshan Lake, Dongguan, Guangdong, China