UV-R1
UV-R1 UV Adhesive Remover
Rework debonding of UV-cured adhesives for optical and circuit-board parts; compliant alternative free of carcinogenic halogenated solvents.
Technical Description
UV-R1 is a UV-adhesive remover from Shengpu Chemical for reworking optical lenses and circuit boards. Benchmarked against Loctite/3M traditional debonders, it is the compliant alternative free of carcinogenic halogenated solvents and reproductive toxins — solvents that also swell and damage polarizers and plastic parts, and that most domestic debonders still rely on. High-purity solvent synergy swells acrylate UV adhesives for removal by swelling-and-peeling at room temperature, with storage and handling constraints (flash point ~44°C) that keep it safe for optical and electronic rework processes.
Introduction
UV-R1 UV Adhesive Remover (UV-R1) is developed by SEMPURION for Optical lenses / circuit boards as a De-gum / De-bond product.Key advantage: Rework debonding of UV-cured adhesives for optical and circuit-board parts; compliant alternative free of carcinogenic halogenated solvents.. Benchmarked against Loctite / 3M traditional debonders — this product is the compliant alternative without carcinogenic halogenated solvents; most domestic debonders still use halogenated routes. Key features: Free of carcinogenic halogenated solvents and reproductive toxins — the carcinogenic solvents in traditional debonders also swell and damage polarizers and plastic parts, making them unusable for optical and electronic rework, a real replacement demand; high-purity solvent synergy: primary solvent strongly swells acrylate UV adhesives, slow-evaporation additive widens the working time window, and a penetrating additive speeds ingress; debonding proceeds by swelling-and-peeling (UV adhesives are highly crosslinked and neither dissolve nor melt). Typical process: Room-temperature use; blend closed-cup flash point approx. 44°C — no heating, no atomizing, store below 35°C; thin adhesive 5–15 min, thick 20–40 min, then pry off; PC/ABS plastic parts swell and whiten with prolonged soak — control contact time and wipe promptly; clean solder-pad areas with an alcohol-type solvent after debonding.
Quick Specs
Features
Free of carcinogenic halogenated solvents and reproductive toxins — the carcinogenic solvents in traditional debonders also swell and damage polarizers and plastic parts, making them unusable for optical and electronic rework, a real replacement demand; high-purity solvent synergy: primary solvent strongly swells acrylate UV adhesives, slow-evaporation additive widens the working time window, and a penetrating additive speeds ingress; debonding proceeds by swelling-and-peeling (UV adhesives are highly crosslinked and neither dissolve nor melt)
Process & Usage
Room-temperature use; blend closed-cup flash point approx. 44°C — no heating, no atomizing, store below 35°C; thin adhesive 5–15 min, thick 20–40 min, then pry off; PC/ABS plastic parts swell and whiten with prolonged soak — control contact time and wipe promptly; clean solder-pad areas with an alcohol-type solvent after debonding
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- Phone
- +86 769-82786068
- sales@sempurion.com
- Website
- www.sempurion.com
- Address
- Songshan Lake, Dongguan, Guangdong, China