L730
L730 Debonding Solution for Fingerprint Modules
Specialized adhesive debonding for fingerprint modules using an alkaline plus penetrating-solvent swelling system.
Technical Description
L730 is an adhesive debonding solution specialized for separating lamination adhesive in fingerprint modules during rework or disassembly. Benchmarked against industry-standard fingerprint-module debonders, its alkaline plus ether-penetrant system swells and releases the adhesive bond at room temperature by immersion or ultrasonic. Note that water-proof adhesive grades were not released by this system in testing and need separately assessed chemistry.
Introduction
L730 Debonding Solution for Fingerprint Modules (L730) is developed by SEMPURION for Separation of fingerprint-module lamination adhesive (rework/disassembly) as a Cleaning / Grinding product.Key advantage: Specialized adhesive debonding for fingerprint modules using an alkaline plus penetrating-solvent swelling system.. Benchmarked against Industry-standard fingerprint-module adhesive debonders. Key features: Alkaline system + ether-type penetrating solvents swell and separate the bond; water-proof adhesives are unaffected in testing and require a separately assessed system. Typical process: Alkaline system + penetrating-solvent swelling; room-temperature immersion or ultrasonic, then rinse.
Quick Specs
Features
Alkaline system + ether-type penetrating solvents swell and separate the bond; water-proof adhesives are unaffected in testing and require a separately assessed system
Process & Usage
Alkaline system + penetrating-solvent swelling; room-temperature immersion or ultrasonic, then rinse
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- Phone
- +86 769-82786068
- sales@sempurion.com
- Website
- www.sempurion.com
- Address
- Songshan Lake, Dongguan, Guangdong, China