99 products found
Carbon-based composite mold for 3D glass hot forming that withstands 750°C+ (enabling glass-ceramic forming) and delivers over 50x the service life of graphite molds, supporting 3D double-curved and large-curvature shapes.
Carbon-based composite diffusion-bonding mold that replaces graphite tooling for solid-state Cu-Al diffusion bonding and Cu-Al vacuum brazing of soft busbars (laminated busbars, flexible connectors, nickel/aluminum transition strips) — heat- and pressure-tolerant, dimensionally stable and non-shedding
Carbon-based composite high-temperature carrying fixtures/trays replacing graphite and metal tooling for sintering, heat treatment and other high-temperature processes.
Dedicated pre-cleaner for particle removal on FOUP/FOSB: concentrate diluted 1:4, neutral pH 6.5–7.5, chemical clean at 50–65 °C for 3–8 min, spray-safe with <5 mm foam
Flagship of the SP-Clear series: primary product for organic contamination and VOC removal on FOUP/FOSB — 1:4 dilution, pH 8.5–9.5, clean at 55–75 °C for 5–10 min; HSP verified RED=0.59
Dedicated cleaner for high-temperature PEI ESD FOUP: 1:4 dilution, pH 9.5–10.5, clean at 70–90 °C for 5–10 min (not for PC ESD material)
Strong-alkali cleaning for PFA/PTFE/Teflon wafer carriers and cleaning baskets: 1:9 dilution, pH 12.8–13.2, clean at 70–100 °C for 5–15 min — spray, immersion or ultrasonic
Neutral cleaner for mask and reticle storage boxes: 1:4 dilution (UPW recommended), pH 6.5–7.5, clean at 40–60 °C for 5–10 min; GLDA+EDTA dual chelation for Haze control
Eco-friendly water-based cleaner that thoroughly removes flux and rosin residues.
Semi-aqueous stencil cleaner with solvency and eco-profile between solvent-based and water-based products.
One-step removal of blue/UV tape adhesive residue after wafer dicing, balancing stripping power with wafer/chip safety.
Removes particles and metallic residues after CMP; technology extension of the SP-Clear series.
Efficient removal of polymer residues after dry etch and ashing; water-based with high closed-cup flash point for safe operation at 70°C.
Removes edge bead residue after lithography; electronic-grade purity for yield protection.
Low-foam mild-alkaline cleaner removing residual plating solution and particles after bump plating.
Semi-aqueous, eco-friendly removal of post-soldering flux and rosin residues.
Low-residue, fast-drying cleaning after BGA rework.
Removes adhesive residue left after temporary bonding/de-bonding; water-based with a closed-cup flash point above 60°C for safe heated operation.
Removes particles and metallic residues after back-grinding/thinning; improved SC1-type formulation.
Cleans inside high-aspect-ratio through-glass vias; surface tension below 30 mN/m lets the bath penetrate straight to the via bottom.
Post-etch surface and post-CMP cleaning compatible with fluorine-containing etch residues on TGV glass substrates.
Strips RDL/semiconductor photoresist by migrating proven ACF-debonding chemistry; copper loss below 0.05 µm/h at 70°C.
Selective etching of Cu/Ti seed layers for TGV/RDL patterning with endpoint control and near-zero attack on the glass substrate.
Complete UBM seed-layer etch kit — separate copper and titanium etchants for stepwise processing; near-zero glass loss.
Modifies glass before TGV seed-layer deposition to multiply copper adhesion; 5B tape-peel rating and 240 h 85°C/85%RH reliability demonstrated.
High-purity Ti etching for 1 µm fine lines with side etch below 0.3 µm; excellent selectivity to glass, SiO₂ and photoresist.
Etchant for next-generation Mo interconnect metal, positioning for future process nodes; classic PAN chemistry plus an Al-compatible option.
Etchant for ruthenium, a candidate next-generation interconnect metal; formulation significantly suppresses escape of highly toxic volatile byproducts.
W/TiW etching for advanced packaging metallization; cyanide-free alkaline chemistry with stable supply chain.
Packaging-grade standard developer system for RDL processes; electronic-grade purity with no metal ions (MIF).
Through-glass-via etch by femtosecond-laser modification plus hot-alkali etching; >50:1 selectivity with near-zero etch of bulk glass and no toxic fluorine acids.
Cold-soak removal of ACF adhesive residue without attacking ITO; works at room temperature with no heating equipment.
Precision cleaning before IC/display bonding; halogen-free, phosphorus-free, nitrogen-free and flash-point-free, designed to a no-residue standard.
Removes OCA/LOCA adhesive residue during screen disassembly and rework without damaging the polarizer.
Chemical stripping of polarizers during display-module disassembly/recycling; alkali bath separates polarizer from glass while protecting the glass substrate.
Rework debonding of UV-cured adhesives for optical and circuit-board parts; compliant alternative free of carcinogenic halogenated solvents.
Color-filter development benchmarked against Nippon Kayaku; fills a near-empty domestic gap for color-filter lines.
Process cleaning for color-filter lines; safe to ITO, phosphorus-free and APEO-free with a low-foam design.
Substrate cleaning before polyimide coating; respects the PI red line — no hydrolysis or swelling damage to cured alignment layers.
Cleaning for the liquid-crystal stage of panel processes; a three-no standard keeps the LC cell safe.
Pattern etching of ITO for panels and touch; organic-acid route with excellent selectivity to glass, photoresist and black matrix.
Etches Mo/Al wiring in copper-process TFT-LCD lines for 4K2K panels; blended-acid mainstream route balancing etch rate and line profile.
Safety companion for glass thinning lines — pre-thinning pretreatment and post-thinning cleaning on a fluorine-free route.
Process cleaning for 3D curved glass.
General-purpose cleaning across glass manufacturing processes.
Eco-friendly glass cleaning.
Eco-friendly glass cleaning with fast drying and fewer water marks.
General-purpose alkaline cleaning for glass substrates.
Oxidative-decomposition cleaning for glass.
Multi-component general-purpose cleaning for glass process lines.
Pre-bending degreasing plus coolant-residue cleaning in one product.
Drop-in domestic alternative to Deconex OP164 for precision glass cleaning.
Neutral cleaning for panel AOI inspection steps.
Companion additive for the OP164 cleaning system.
Dedicated stripper for TOYO-series inks combining strong alkali with penetrating peel-off chemistry.
Mature alkaline ink-stripping solution that adapts directly to production-line processes.
General-purpose screen-printing ink stripper.
One bath strips both ink and coatings on optical glass — a dual-function solution covering two rework cases.
Customer-process-tuned, high-solvent stripper targeting stubborn screen-printing inks.
Combined adhesive-debonding and ink-stripping solution — one product for two rework jobs.
Dedicated rework stripper for cover glass; stable alkali-plus-penetrating-solvent ink removal.
Mass-production stripper for TOYO BL-7M056 ink; strong-alkali plus penetrating peel-off system; 1,581 units passed full production validation.
Stripper for PVD coatings on glass.
Dedicated stripper for PVD coatings on metal parts.
Removes heavy plated coatings from umbrella hardware.
Stripper for coated glass parts using a blended acid-etch system.
Project-customized stripper for niobium pentoxide (Nb₂O₅) coatings on optical coated glass.
Ambient-temperature stripping · eco-friendly acidic system · HF-free, no potassium ferricyanide · 2–5 min stripping
Removes nickel coatings from glass without damaging the glass or the ink — mild acid-etch system.
Specialized adhesive debonding for fingerprint modules using an alkaline plus penetrating-solvent swelling system.
High-concentration display lamination adhesive remover (final version) that strips adhesive without damaging the AF coating.
Lamination-adhesive remover that protects the AF coating throughout the debonding process.
Simplified lamination-adhesive remover that keeps the core AF-safe capability with a leaner system.
Adhesive remover for display lamination debonding.
Low-foam cleaner built for spray cleaning lines.
Low-foaming cleaner for washing/spray lines.
Simplified low-foam cleaner.
Ceramic-based high-temperature release coating for glass hot bending; withstands 850°C+ in oxidizing atmospheres (900–1250°C upgrade under development).
Cleans hot-bending graphite molds without damaging the graphite.
Dedicated degreaser for CNC-machined aluminum parts.
Post-fine-grinding cleaning for metal and glass parts.
Stainless steel degreasing completed in 1 minute at 10% concentration and 55°C.
Acidic co-cleaner system for fine-ground metal and glass.
Fluorine-containing acidic composite passivation for stainless steel and aluminum alloys.
Cooling and lubrication fluid dedicated to CNC grinding of glass.
Solvent-type machine wash for cleaning production equipment.
Specialized remover for display lamination adhesive.
Wipe-cleaning reagent for equipment surfaces with a blended-solvent system.
High-purity molybdenum boat for vacuum evaporation and sintering carriers, T0.2×L58 mm.
Thin-profile molybdenum boat for fine coating jobs, T0.15×H15×W23 mm.
High-purity molybdenum evaporation carrier box for high-temperature loading.
Carbon tube for coating and process use — companion consumable supply.
Aqueous anti-static functional cleaner: added directly to the customer's existing alkaline or neutral cleaning bath, it neutralises surface static charge and suppresses static re-generation during cleaning, preventing particle adsorption that forms pitting and white spots before and after coating, while improving water-film spreading for a fast-drying, streak-free finish.
Abrasive-additive anti-static agent: added directly to the blasting abrasive, 0.5–1.0% markedly reduces friction-generated static, suppressing dust adsorption and abrasive agglomeration without affecting the blast finish.
Cleaning, lubrication, anti-corrosion and cooling in one — built for high-precision dicing of hard-brittle materials; less edge chipping, protects on-metal layout and pads, easy to rinse clean.
Cleaning, lubrication, anti-corrosion and cooling in one; a unique formula supporting high-dilution use (1:2000) for high efficiency at low cost — same functions as SEM-1000.
Selective ambient-temperature stripping of the visible area on PC / PMMA decorative parts — substrate and decorative coating preserved.
Ambient-temperature stripping · eco-friendly acidic system · HF-free, no potassium ferricyanide · low-concentration grade
Post-coating cleaning · neutral system that does not attack the coating · low-foam spray · 45–50 °C / 1–3 min