CC-MOLD

Diffusion-bonding carbon-based composite mold (CC-MOLD) is a carbon-based composite carrier mold/platen from Shengpu Chemical's specialty new-material line, built for making new-energy Cu-Al soft connections — replacing traditional graphite molds in the high-temperature, pressurized joining of copper-aluminum soft busbars (laminated busbars, flexible connectors, and nickel/aluminum transition strips), by either of two mainstream routes used in China's Cu-Al soft-busbar industry (locally also known as 高分子扩散焊).

In Cu-Al soft-busbar production, the copper-aluminum dissimilar joint is made mainly by two high-temperature routes: (1) solid-state Cu-Al diffusion bonding (Cu-Al diffusion welding) — stacked copper and aluminum strip is heated in a vacuum or inert atmosphere under pressure between upper and lower molds so Cu and Al atoms diffuse across the interface to form a metallurgical bond — and (2) Cu-Al vacuum brazing, where an aluminum-silicon filler melts and joins the interface in a vacuum furnace. Both routes require molds that withstand the joining temperature without deforming under sustained load, keep a dense non-shedding surface so as not to contaminate the Cu-Al interface, and conduct heat evenly for a uniform joint-line temperature field. Traditional graphite molds in these processes tend to oxidize, shed particles and wear, harming joint quality and yield.

Carbon-based composite (carbon-fiber-reinforced ceramic matrix) does not oxidize in these temperature windows, deforms minimally under high pressure, stays dimensionally stable over long runs, and is dense and wear-resistant without shedding, so it can replace graphite as the upper/lower carrier mold for more consistent joint quality and far longer tool life. Positioned as a cleaner, more stable, longer-life upgrade over high-purity graphite molds. Key selling point: a carbon-based composite diffusion-bonding mold replacing graphite, heat- and pressure-tolerant and non-shedding, for solid-state Cu-Al diffusion bonding and vacuum-brazing lines in new-energy Cu-Al soft-busbar interconnection.