BGA-R1
BGA-R1 BGA Rework Cleaner
Low-residue, fast-drying cleaning after BGA rework.
Technical Description
BGA-R1 is a fast-dry, no-rinse cleaner for flux residue removal after BGA rework. Benchmarked against Chemtronics Flux-Off (fast-dry type), it balances quick drying with white-spot prevention and leaves no film or haze while protecting solder mask and molding compound. Applied neat by brush, spray or immersion, it is a flammable blend (flash point ≈15–20°C) requiring ventilation, no ignition sources and static grounding.
Introduction
BGA-R1 BGA Rework Cleaner (BGA-R1) is developed by SEMPURION for BGA packages / PCBA as a PCBA Cleaning product.Key advantage: Low-residue, fast-drying cleaning after BGA rework.. Benchmarked against Chemtronics Flux-Off (fast-dry type). Key features: Balances fast drying with white-residue prevention; no-rinse fast dry (surface dry ≤2 min at 25°C); no white spots, haze or film residue after drying; safe for solder mask and molding compound. Typical process: Use neat at room temperature by brush, spray or immersion for 1–3 min (stubborn flux: 40–50°C immersion for 5 min); air-dry or blow dry with N₂; no-rinse, parts return directly to rework; blend flash point approx. 15–20°C — flammable, keep ventilated, no open flames, ground static.
Quick Specs
Features
Balances fast drying with white-residue prevention; no-rinse fast dry (surface dry ≤2 min at 25°C); no white spots, haze or film residue after drying; safe for solder mask and molding compound
Process & Usage
Use neat at room temperature by brush, spray or immersion for 1–3 min (stubborn flux: 40–50°C immersion for 5 min); air-dry or blow dry with N₂; no-rinse, parts return directly to rework; blend flash point approx. 15–20°C — flammable, keep ventilated, no open flames, ground static
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- Phone
- +86 769-82786068
- sales@sempurion.com
- Website
- www.sempurion.com
- Address
- Songshan Lake, Dongguan, Guangdong, China